US chipmaker Intel will invest an additional 208 million USD in its operations in Malaysia, reinforcing the Southeast Asian nation’s role in the global semiconductor supply chain.
Malaysian Prime Minister Anwar Ibrahim on December 1 announced on Facebook that Intel CEO Lip-Bu Tan had confirmed the additional investment to make Malaysia a key hub for the company’s chip assembly and testing activities. The decision reflects Intel’s confidence in Malaysia’s long-term strategic plans.
Construction of Intel’s advanced chip packaging plant in Penang, northern Malaysia, is now 99% complete, with the company expressing appreciation for government support.
Malaysia is the world’s sixth-largest semiconductor exporter and holds a 13% global market share in chip assembly, packaging, and testing. In 2021, Intel pledged 7 billion USD to build the Penang facility, located in the country’s electronics hub.
The US is Malaysia’s third-largest market for semiconductor exports. In 2024, Malaysia exported 120 billion MYR (28 billion USD) in electrical and electronic products to the US, with around half related to chips.
